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(Schematci) Add functional logical blocks in schematic to use similar circuits in future versions or other projects |
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(Manufacturing) Use stencil SMD soldering with SMD components only if it is necessary. Else, use a PCB assembly service. |
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(Manufacturin) Use minimum number of through-hole components |
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(Manufacturing) Check Gerber file format with the PCB manufacturer before rendering them |
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(Manufacturing) Check <code>F.Paste</code> and <code>B.Paste</code> layers for SMD stencil pattern |
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(Testing) Pull out every single MCU pin as a test point for the first version of the project. |
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(BOM) Always buy buffer number of components. Image is from the book Designing Electronics That Work by Hunter Scott. |
buffer-components.png |
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(Layout) Make the PCB routing symmetrical for LED positions and connector slots |
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(Case) Ensure the length is not too long to prevent bending of the material |
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(Case) Use wider ventilation holes with wider spacing between each of them |
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(Case) Use less clearance for connector slots. Take note of finger access |
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(Case) Use other shapes for connector slots E.g. rounded corner or trapezoid |
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(Case) Use shape binder for seperation plane bends |
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(Case) Use a counter sunk screw head |
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(Case) Make the screw lug's initial length be wider to contain the screw head so that it can sink into the surface |
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(Case) Try a snap-fit enclosure |
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(Manufacturing) Use SMD components only on top layer for one-step manual SMD stencil soldering process |
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(Layout) Place a writable area on the silkscreen to note down LoRa node address, PCB number, frequency or other info |
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(BOM) Use a smaller <code>SSD1306</code> I2C OLED display instead of E-Ink. It's cheaper and easier to source and buy. |
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(Testing) Check with 3 PCBs to conclude whether it is a design issue or a soldering / manufacturing / assembly issue |
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(Testing) Power it with current limiting power supply unit only. Check all the power test points such as <code>VBAT</code>, <code>VBUS</code>, <code>3.3V</code>, <code>5V</code>, <code>GND</code>. |
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