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Fabrication
The MISRC is a 2 sided, 2 layer PCB with a dedicated set of headers for a data interface sub-board (either FX3 USB 3.0 dev board or Tang Nano 20k Currently)
Thanks to assembly services today you can have almost any PCB fabricated!
Or you can alternatively manually order via the Gerber files provided on the main repository.
Note
- The vias in the pads are there on purpose:
- There is a bottom pad on the voltage regulator, for hand soldering the vias are necessary to solder that pad and it's for thermal reasons.
(Note add 1-2-3 step images)
As the board is built around 0805 standard size parts most people with a steady handy can hand solder these parts with a Bevel tip and a pair of tweezers.
Step 1:
Clean your PCB with 99.9% IPA, this cleans any surface contaminate off.
Step 2:
Prepare your Flux, Solder 60/40 & Components
Step 3:
You can use solder paste if you have a solder stencil made or manually populate each pad.
Or bare solder via coating the PCB with flux, with a clean and tinned tip populate 1 side of the pad then move the component with tweezers into the pad while melted via iron then simply flow a small amount of solder onto the other pad.
Step 4:
You will want to populate 2.54mm header pins last, and BNCs last as these are the hardest to de-solder and headers easiest to melt and very easy to damage pads without a de-soldering gun.