3D-ICE stands for 3D Interlayer Cooling Emulator. It is a Linux-based Thermal Emulator Library written in C, which can perform transient thermal analyses of vertically stacked 3D integrated circuits with inter-tier Microchannel Liquid Cooling. The latest version, namely 3D-ICE 3.1, supports fully customized non-uniform thermal modeling and different heat sink models.
To get more information about 3D-ICE, and how to use and install it, please refer to the 3D-ICE_User_Guide in the doc folder. It helps you get started with 3D-ICE and serves as a quick reference later on. Click here if you want to know more about the modeling theory aspects of 3D-ICE.
We are constantly looking for your feedback and comments in our strive to improve 3D-ICE. Please send your emails to 3d-ice@listes.epfl.ch. You must subscribe to this mailing list in order to be able to communicate with us and also receive notifications about new releases and updates on new patches, bugs, etc. Notifications will be kept as limited and as brief as possible and THERE WILL BE NO SPAMMING of your mailbox. In addition, this mailing list will serve as a forum where you can interact with other users of 3D-ICE.
IMPORTANT INFORMATION: Any usage of 3D-ICE for research, commercial or other purposes should be properly acknowledged in the resulting products or publications. Specifically, publications 1, 2, and 3 below should be appropriately cited.
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F. Terraneo, A. Leva, W. Fornaciari, M. Zapater, D. Atienza, 3D-ICE 3.0: efficient nonlinear MPSoC thermal simulation with pluggable heat sink models, Transactions on Computer-Aided Design of Integrated Circuits and Systems Volume 40 pp. 1-14, 2021-04-19
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A. Sridhar, A. Vincenzi, D. Atienza and T. Brunschwiler, 3D-ICE: A Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs, IEEE Transactions on Computers, vol. 63, no. 10, pp. 2576-2589, Oct. 2014, doi: 10.1109/TC.2013.127
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A. Sridhar, A. Vincenzi, M. Ruggiero, T. Brunschwiler and D. Atienza, 3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling, 2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, CA, 2010, pp. 463-470, doi: 10.1109/ICCAD.2010.5653749
3D-ICE is free software: you can redistribute it and/or modify it under the terms of the GNU General Public License as published by the Free Software Foundation, either version 3 of the License or any later version.
3D-ICE is distributed in the hope that it will be useful, but WITHOUT ANY WARRANTY; without even the implied warranty of MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the GNU General Public License for more details.
You should have received a copy of the GNU General Public License along with 3D-ICE. If not, see http://www.gnu.org/licenses/.
Copyright (C) 2021
Embedded Systems Laboratory - Ecole Polytechnique Federale de Lausanne
All Rights Reserved.
Authors: Arvind Sridhar Alessandro Vincenzi
Giseong Bak Martino Ruggiero
Thomas Brunschwiler Eder Zulian
Federico Terraneo Darong Huang
Luis Costero Marina Zapater
David Atienza
For any comment, suggestion or request about 3D-ICE, please register and
write to the mailing list (see http://listes.epfl.ch/doc.cgi?liste=3d-ice)
Any usage of 3D-ICE for research, commercial or other purposes must be
properly acknowledged in the resulting products or publications.
EPFL-STI-IEL-ESL Mail : 3d-ice@listes.epfl.ch
Batiment ELG, ELG 130 (SUBSCRIPTION IS NECESSARY)
Station 11
1015 Lausanne, Switzerland Url : https://esl.epfl.ch/3d-ice
January 13, 2022 Version 3.1
February 10, 2021 Version 3.0
June 1, 2019 Version 2.2.8
October 25, 2018 Version 2.2.7
August 2, 2016 Version 2.2.6
March 25, 2013 Varsion 2.2.5
February 5, 2013 Version 2.2.4
September 20, 2012 Version 2.2.3
August 13, 2012 Version 2.2.2
July 31, 2012 Version 2.2.1
July 24, 2012 Version 2.2
March 23, 2012 Version 2.1
December 7, 2011 Version 2.0
July 11, 2011 Version 1.0.3
June 6, 2011 Version 1.0.2
October 7, 2010 Version 1.0.1
September 28, 2010 Version 1.0